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Ships within 48 hours · Estimated delivery Sep 11 - Sep 16
Dimension: ∮48*93
Bubble Remover For iPhone/ Samsung/Huawei/ Xiaomi/ HTC/ Motolora/ Oppo/ LG/ SONY
Quickly judge the failure point of no display or camera not working through the EDP display connector
Maximum Voltage: 35
Two ways of temperature display modes (centigrade ℃
XZZ L23 CPU Reballing Stencil Platform For iPhone A8-A16 BGA Repair TBK Dimension: ∮48*93XZZ L23 CPU Universal BGA Reballing Stencil Platform for iPhone A8 A16 Qualcomm MTK Hisilicon CPU tin planting. XZZ L23 BGA Reballing Stencil Platform for iPhone 6 to 14 Pro Max A8 A9 A10 A12 A13 A14 A15 A16, Qualcomm, MTK, Hisilicon CPU IC soldering repair. Features: Magnetic power positioning with strong magnetic force and automatic alignment. Built in powerful magnets with strong adsorption for easy pick up and fast maintenance. Easy to operate